Polyamide adhesive C0874 / C0874S
Beneficii și caracteristici
Low pressure injection moulding of electrical components and plug forms. Securing of electrical components on printed circuit boards, as well as enamelled wires on spools. Also available in black.
- Sticks and granules in two colours
- Good thermal stability and elasticity
- Good adhesion on soft PVC
- Excellent cold stability (down to -30 °C)
Date tehnice
Baza
Poliamid
Temperatura przetwarzania
180 - 210°C
Możliwość rozpylania
Nie
Forma dostawy
Granulat, laski
Domenii de aplicare
Opis
Note: Slight colour variations may occur with adhesives, depending on the raw materials and processes used.
The hot-melt adhesive has good flexibility and plasticiser resistance.
Good thermal stability, good cold flexibility. Adhesion: Excellent adhesion to wood, paper, leather, ABS, PVC, PC, soft PVC and PU foam.
The hot-melt adhesive has the UL94V-2 test certificate.
| Type | Basis | Delivery form | Appropriate application techniques |
| C20874 | Polyamide | Sticks, Ø ca.12 mm | Mechanical glue guns |
| C20874 (black) | Polyamide | Sticks, Ø ca.12 mm | Mechanical glue guns |
| C40874 | Polyamide | Granules | Pneumatic glue guns, melters |
| C40874 (black) | Polyamide | Granules | Pneumatic glue guns, melters |
Hot Melt Glue Gun HB 250
HB 710 Bead HT (High Temperature)
