Mikrogłowica HB 11 do dysz 3/8
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DK 1/30 HT application head - Bead

Mikrogłowica HB 11 linowa

Beneficii și caracteristici

The use of high-quality seals makes temperatures of up to 250 °C possible.

  • High temperature version
  • Bead and dot application
  • Modular construction

Date tehnice

DITO bueprod_customfields_technik.php
Moc grzewcza 200 W
Zakres temperatur 50 - 250 °C
maks. ciśnienie 120 bar
Wymiary 102 x 46 x 137 mm
Gwint UNF 3/8''
Liczba modułów 1

Domenii de aplicare

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Opis

Due to the use of high-quality seals, temperatures of up to 250 °C are possible.

The DK 1/30 HT is often used to process polyamide hot-melt adhesives. Its modular structure makes it easy to maintain.

The application head is delivered without a nozzle.

  • High temperature version up to 250 °C
  • Incl. solenoid valve and solenoid valve attachment kit
  • Incl. 1 module with UNF 3/8'' thread for the use of standard nozzles
  • PT100
  • Air-opening / air-closing
  • Head holder for 10 mm round bar
  • Needle stroke adjustment
  • Airtech 230 V
  • Hose connection SA 8
  • Optional: Airtech 24 V
Article number Description Sensor Version
410113 DK 1/30 HT Bead application head PT100 230 V
411133 DK 1/30 HT Bead application head PT100 24 V
DITO SUBLAYOUTS/customfields.php / ALLE customfields eines Produktes einlesen
DITO SUBLAYOUTS/customfields.php / ALLE customfields eines Produktes einlesen

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